Epoxy Bonding Fin
Epoxy Bonding Heat Sink
Bonded fin heat sink, also called bonded heat sink, is a heat sink assembly process that uses a high thermal conductivity bonding material to combine the heat sink base plate with the fins. This process is currently very mature and has been widely used. The application field includes heat dissipation of military equipment with strict requirements.
Features
Inserting Fin By Closing Pressing
Making groove in the base firstly, then put the fins into the groove by punch pressing and tightly to combine them together. Simple process and reasonable cost, but poor reliability.
Bonding Fin Heat Sink
By brushing the epoxy resin in the groove, which has some thermal conductivity and bonding capacity, bonding the fins into the groove one by one. Advantages are: Simple process, moderate cost, reliability and equivalent performance with inserted fins.
Bonded Fin Heat Sink Features As The Following
- Higher aspect ratio and high fin density of fins increase cooling surface area so the heat sink with high performance.
- Lower thermal resistance for the high power device heat dissipation.
- Aluminum fin, copper base, aluminum base can be assembled into bonded fin assemblies
- Fins fabricated from sheet metal or extrusion, custom designs available, the metal plate is made of fins, which can be cut to a specific size.
- We can customize your wings according to thermal performance requirements and packaging size height restrictions. For more complex designs, we can extrude fins to specific shapes and lengths.
- Used for high power forced convection cooling applications.
- Bonding resin with highly thermal conductive for minimal thermal loss.
- Dissipate more heat than the conventional heat sinks with the same footprint.
- Reduce heat sink and overall system volume.
- Increase the aluminum cooling surface area by two to three times than traditional heat sink
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